Semiconductor device and method of controlling same

ABSTRACT

A semiconductor device includes a semiconductor part having a first surface and a second surface opposite to the first surface, a first electrode on the first surface, a second electrode on the second surface, first to third control electrodes between the first electrode and the semiconductor part. The first to third control electrodes are biased independently from each other. The semiconductor part includes a first layer of a first-conductivity-type, a second layer of a second-conductivity-type, a third layer of the first-conductivity-type and the fourth layer of the second-conductivity-type. The second layer is provided between the first layer and the first electrode. The third layer is selectively provided between the second layer and the first electrode. The fourth layer is provided between the first layer and the second electrode. The second layer opposes the first to third control electrode with insulating films interposed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No. 16/573,593filed on Sep. 17, 2019 and based upon and claims the benefit of priorityfrom Japanese Patent Application No. 2019-050702, filed on Mar. 19,2019, and Japanese Patent Application No. 2019-166842, filed on Sep. 13,2019; the entire contents of all of which are incorporated herein byreference.

FIELD

Embodiments relate to a semiconductor device and a method of controllingthe same.

BACKGROUND

For example, an insulated gate bipolar transistor (hereinbelow, IGBT) isused as a semiconductor device controlling a large current under thehigh voltage of 600 V or more. For example, IGBT is used for powerconversion in which both a low steady loss (a low on-resistance) and alow switching loss (a fast switching speed) are desirable to increasethe conversion efficiency.

To reduce the on-resistance, many IGBTs of recent years have a trenchgate structure extending deeply into the n-type base layer through thep-type base layer. Thereby, the channel density can be increased;carriers inside the n-type base layer can be accumulated efficiently byutilizing the configurations of the trench gates that aremutually-adjacent inside the n-type base layer; and the on-resistancecan be reduced in the steady state. However, when a low on-resistance isrealized by increasing the amount of the accumulated carriers, thecarrier amount to be ejected is high while turning off. Therefore, theturn-off time lengthens; and the turn-off loss increases. In otherwords, there is a trade-off relationship between the decrease of theon-resistance and the decrease of the turn-off loss.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view showing a semiconductordevice according to an embodiment;

FIG. 2 is a time chart showing an operation of the semiconductor deviceaccording to the embodiment;

FIGS. 3A to 3C are schematic views showing the operation of thesemiconductor device according to the embodiment;

FIG. 4 is a schematic cross-sectional view showing a semiconductordevice according to a modification of the embodiment;

FIG. 5 is a schematic cross-sectional view showing a semiconductordevice according to another modification of the embodiment;

FIG. 6 is a schematic cross-sectional view showing a semiconductordevice according to yet another modification of the embodiment;

FIG. 7 is a schematic cross-sectional view showing a semiconductordevice according to other modification of the embodiment;

FIG. 8 is a time chart showing an operation of the semiconductor deviceaccording to the other modification of the embodiment; and

FIGS. 9A to 9C are schematic views showing the operation of thesemiconductor device according to the other modification of theembodiment

DETAILED DESCRIPTION

According to one embodiment, a semiconductor device includes asemiconductor part including a first semiconductor layer of a firstconductivity type, the semiconductor part having a first surface and asecond surface, the second surface being positioned on a side oppositeto the first surface; a first electrode provided on the first surface; asecond electrode provided on the second surface; a first controlelectrode provided between the first electrode and the semiconductorpart; a second control electrode provided between the first electrodeand the semiconductor part; and a third control electrode providedbetween the first electrode and the semiconductor part. The firstcontrol electrode is electrically insulated from the semiconductor partby a first insulating film, and electrically insulated from the firstelectrode by a second insulating film. The second control electrode iselectrically insulated from the semiconductor part by a third insulatingfilm, and electrically insulated from the first electrode by a fourthinsulating film. The second control electrode is biased independentlyfrom the first control electrode. The third control electrode iselectrically insulated from the semiconductor part by a fifth insulatingfilm, and electrically insulated from the first electrode by a sixthinsulating film. The third control electrode is biased independentlyfrom the first control electrode and the second control electrode. Thesemiconductor part further includes a second semiconductor layer of asecond conductivity type, a third semiconductor layer of the firstconductivity type, and a fourth semiconductor layer of the secondconductivity type. The second semiconductor layer is provided betweenthe first semiconductor layer and the first electrode. The thirdsemiconductor layer is selectively provided between the secondsemiconductor layer and the first electrode. The fourth semiconductorlayer is provided between the first semiconductor layer and the secondelectrode. The second semiconductor layer opposes the first controlelectrode with the first insulating film interposed. The secondsemiconductor layer opposes the second control electrode with the secondinsulating film interposed. The second semiconductor layer opposes thethird control electrode with the third insulating film interposed.

Embodiments will now be described with reference to the drawings. Thesame portions inside the drawings are marked with the same numerals; adetailed description is omitted as appropriate; and the differentportions are described. The drawings are schematic or conceptual; andthe relationships between the thicknesses and widths of portions, theproportions of sizes between portions, etc., are not necessarily thesame as the actual values thereof. The dimensions and/or the proportionsmay be illustrated differently between the drawings, even in the casewhere the same portion is illustrated.

There are cases where the dispositions of the components are describedusing the directions of XYZ axes shown in the drawings. The X-axis, theY-axis, and the Z-axis are orthogonal to each other. Hereinbelow, thedirections of the X-axis, the Y-axis, and the Z-axis are described as anX-direction, a Y-direction, and a Z-direction. Also, there are caseswhere the Z-direction is described as upward and the direction oppositeto the Z-direction is described as downward.

FIG. 1 is a schematic cross-sectional view showing a semiconductordevice 1 according to an embodiment. The semiconductor device 1 is, forexample, an IGBT. The impurity distribution and the value of theimpurity concentration of each semiconductor layer in the specificationcan be measured using, for example, secondary ion mass spectrometry(SIMS) or spreading resistance analysis (SRA). The relative high/lowrelationship of the impurity concentrations of two semiconductor layerscan be determined using, for example, scanning capacitance microscopy(SCM). The relative high/low relationship and/or the absolute value ofthe carrier concentration of the semiconductor region are determined bySCM and SRA. By assuming the activation rate of the impurity, it ispossible to determine the absolute value of the impurity concentration,the distribution of the impurity concentration, and the relativehigh/low relationship between the impurity concentrations of twosemiconductor layers from the measurement results of SCM and SRA.

As shown in FIG. 1 , the semiconductor device 1 includes a semiconductorpart 10, an emitter electrode 20 (a first electrode), a collectorelectrode 30 (a second electrode), a first gate electrode 40, a secondgate electrode 50, and a third gate electrode 60.

The semiconductor part 10 is, for example, silicon. The semiconductorpart 10 has a first surface 10T and a second surface 10B. The secondsurface 10B is the back surface of the first surface 10T. The emitterelectrode 20 is provided on the first surface 10T. The collectorelectrode 30 is provided in contact with the second surface 10B. Theemitter electrode 20 and the collector electrode 30 include, forexample, at least one selected from the group consisting of aluminum(Al), titanium (Ti), nickel (Ni), tungsten (W), gold (Au), andpolysilicon.

The first gate electrode 40 is provided between the semiconductor part10 and the emitter electrode 20. For example, the first gate electrode40 is disposed inside a trench GT1 provided in the first surface 10Tside of the semiconductor part 10. The first gate electrode 40 extendsin the Y-direction inside the trench GT1. The first gate electrode 40 iselectrically insulated from the semiconductor part 10 by a gateinsulating film 41. Also, the first gate electrode 40 is electricallyinsulated from the emitter electrode 20 by an insulating film 43. Thefirst gate electrode 40 includes, for example, conductive polysilicon.The gate insulating film 41 and the insulating film 43 are, for example,silicon oxide films.

The second gate electrode 50 is provided between the semiconductor part10 and the emitter electrode 20. For example, the second gate electrode50 is disposed inside a trench GT2 provided on the first surface 10Tside of the semiconductor part 10. The second gate electrode 50 extendsin the Y-direction inside the trench GT2. The second gate electrode 50is electrically insulated from the semiconductor part 10 by a gateinsulating film 51. Also, the second gate electrode 50 is electricallyinsulated from the emitter electrode 20 by an insulating film 53. Thesecond gate electrode 50 includes, for example, conductive polysilicon.The gate insulating film 51 and the insulating film 53 are, for example,silicon oxide films.

The third gate electrode 60 is provided between the semiconductor part10 and the emitter electrode 20. For example, the third gate electrode60 is disposed inside a trench GT3 provided on the first surface 10Tside of the semiconductor part 10. The third gate electrode 60 extendsin the Y-direction inside the trench GT3. The third gate electrode 60 iselectrically insulated from the semiconductor part 10 by a gateinsulating film 61. Also, the third gate electrode 60 is electricallyinsulated from the emitter electrode 20 by an insulating film 63. Thethird gate electrode 60 includes, for example, conductive polysilicon.The gate insulating film 61 and the insulating film 63 are, for example,silicon oxide films.

The first gate electrode 40 is electrically connected to a first gatepad 47 via a first gate interconnect 45. The second gate electrode 50 iselectrically connected to a second gate pad 57 via a second gateinterconnect 55. The third gate electrode 60 is electrically connectedto a third gate pad 67 via a third gate interconnect 65. In other words,the first gate electrode 40, the second gate electrode 50, and the thirdgate electrode 60 are biased independently.

The first gate electrode 40 and the second gate electrode 50 each arearranged periodically in a direction along the first surface 10T of thesemiconductor part 10 (e.g., the X-direction). In the example shown inFIG. 1 , the first gate electrode 40 and the second gate electrode 50are arranged adjacent to each other in the X-direction. For example, atleast one of the third gate electrodes 60 is disposed between the firstgate electrode 40 and the second gate electrode 50. In the example, twoof the third gate electrodes 60 are disposed between the first gateelectrode 40 and the second gate electrode 50. Three or more of thethird gate electrodes 60 may be disposed between the first gateelectrode 40 and the second gate electrode 50.

The semiconductor part 10 includes an n-type base layer 11 (a firstsemiconductor layer), a p-type base layer 13 (a second semiconductorlayer), an n-type emitter layer 15 (a third semiconductor layer), ap-type contact layer 17, an n-type buffer layer 19 (a fifthsemiconductor layer), and a p-type collector layer 21 (a fourthsemiconductor layer).

The n-type base layer 11 includes, for example, n-type impurities with aconcentration range of 1×10¹² to 1×10¹⁵ (atoms/cm³). The n-type baselayer 11 has an n-type carrier concentration at which a prescribedbreakdown voltage can be achieved. Here, the n-type carrierconcentration is, for example, the value obtained by subtracting thep-type impurity concentration from the n-type impurity concentration.For example, the p-type impurities with a background-level are includedin the n-type silicon wafer used to form the n-type base layer 11. Forexample, the n-type base layer 11 has a thickness in the Z-direction inthe range of 1 to 1000 μm and is set to a thickness at which theprescribed breakdown voltage can be achieved.

The p-type base layer 13 is selectively provided between the n-type baselayer 11 and the emitter electrode 20. The p-type base layer 13 iselectrically connected to the emitter electrode 20. For example, thep-type base layer 13 is provided to have a p-type impurity amount in therange of 1×10¹² to 1×10¹⁴ cm⁻² and has a thickness in the Z-direction of0.1 to several μm. For example, the p-type base layer 13 is formed byion-implanting the p-type impurities on the first surface 10T side ofthe semiconductor part 10.

The n-type emitter layer 15 is selectively provided between the p-typebase layer 13 and the emitter electrode 20. The n-type emitter layer 15includes n-type impurities with a higher concentration than theconcentration of n-type impurities in the n-type base layer 11. Forexample, the emitter electrode 20 contacts the n-type emitter layer 15and is electrically connected to the n-type emitter layer 15.

For example, the n-type emitter layer 15 is provided to have an n-typeimpurity amount in the range of 1×10¹⁴ to 1×10¹⁶ cm⁻² and has athickness in the Z-direction of 0.1 to several μm. For example, then-type emitter layer 15 is formed by selectively ion-implanting then-type impurity on the first surface 10T side of the semiconductor part10.

The p-type contact layer 17 is selectively provided between the p-typebase layer 13 and the emitter electrode 20. The p-type contact layer 17includes p-type impurities with a higher concentration than theconcentration of p-type impurities in the p-type base layer 13. Forexample, the emitter electrode 20 contacts the p-type contact layer 17and is electrically connected to the p-type contact layer 17. The p-typebase layer 13 is electrically connected to the emitter electrode 20 viathe p-type contact layer 17.

For example, the p-type contact layer 17 is provided to have a p-typeimpurity amount in the range of 1×10¹⁴ to 1×10¹⁶ cm⁻² and has athickness in the Z-direction in the range of 0.1 to several μm. Forexample, the p-type contact layer 17 is formed by selectivelyion-implanting the p-type impurities on the first surface 10T side ofthe semiconductor part 10.

For example, the n-type emitter layer 15 and the p-type contact layer 17may be arranged alternately in the longitudinal direction of thetrenches GT1 to GT3 (e.g., the Y-direction). The ratio of the surfaceareas of the p-type contact layer 17 and the n-type emitter layer 15,which are exposed at the first surface 10T of the semiconductor part 10,can be changed freely according to the desired design. Moreover, then-type emitter layer 15 and the p-type contact layer 17 may have thesurfaces that have freely designed configuration exposed at the firstsurface 10T of the semiconductor part 10.

The trenches GT1 to GT3 have depths capable of reaching the n-type baselayer 11 from the first surface 10T of the semiconductor part 10 throughthe n-type emitter layer 15 and the p-type base layer 13. The trenchesGT1 to GT3 are provided periodically in a direction along the firstsurface 10T of the semiconductor part 10 (e.g., the X-direction). Forexample, the depths of the trenches GT1 to GT3 each are set in the rangeof 1 to 10 μm. For example, the spacing of mutually-adjacent trenches inthe X-direction are set in the range of 0.1 to several μm between thetrench GT1 and trench GT2, between the trench GT1 and trench GT3, andbetween the trench GT2 and trench GT3.

For example, the n-type base layer 11, the p-type base layer 13, and then-type emitter layer 15 are exposed at the side surfaces of the trenchesGT1 to GT3. The first gate electrode 40 is inside the trench GT1 andopposes the p-type base layer 13, which is positioned between the n-typebase layer 11 and the n-type emitter layer 15, with the gate insulatingfilm 41 interposed. The second gate electrode 50 is inside the trenchGT2 and opposes the p-type base layer 13, which is positioned betweenthe n-type base layer 11 and the n-type emitter layer 15, with the gateinsulating film 51 interposed. The third gate electrode 60 is inside thetrench GT3 and opposes the p-type base layer 13, which is positionedbetween the n-type base layer 11 and the n-type emitter layer 15, withthe gate insulating film 61 interposed.

For example, the trench gate structure recited above is multiplyprovided and arranged periodically along the first surface 10T of thesemiconductor part 10. For example, the spacing between the trench gatestructures is set in the range of 0.1 to several μm.

The n-type buffer layer 19 is provided between the n-type base layer 11and the collector electrode 30. The n-type buffer layer 19 includesn-type impurities with a higher concentration than the concentration ofn-type impurities in the n-type base layer 11. For example, the n-typebuffer layer 19 is provided to have an n-type impurity amount in therange of 1×10¹¹ to 1×10¹³ cm⁻² and has a thickness in the Z-direction inthe range of 0.1 to the several tens of μm. For example, the n-typebuffer layer 19 is formed by ion-implanting the n-type impurities on thesecond surface 10B side of the semiconductor part 10.

The p-type collector layer 21 is provided between the n-type bufferlayer 19 and the collector electrode 30. For example, the p-typecollector layer 21 is provided to have a p-type impurity amount in therange of 1×10¹³ to 1×10¹⁵ cm⁻² and has a thickness in the Z-direction inthe range of 0.1 to 10 μm.

For example, the p-type collector layer 21 is formed by ion-implantingp-type impurities into the semiconductor part 10 through the wholesecond surface 10B or the selected portion thereof. For example, thetotal amount of the p-type impurities is set in the range of 1×10¹³ to1×10¹⁵ cm⁻². For example, the implantation energy when forming thep-type collector layer 21 is set to be lower than the implantationenergy when forming the n-type buffer layer 19. Therefore, theimplantation depth of the p-type impurities is shallower than theimplantation depth of the n-type impurities in the n-type buffer layer19.

At the second surface 10B of the semiconductor part 10, the collectorelectrode 30 contacts the surface of the p-type collector layer 21 andis electrically connected to the p-type collector layer 21.

An operation of the semiconductor device 1 according to the embodimentwill now be described with reference to FIG. 1 , FIG. 2 , and FIGS. 3Ato 3C. FIG. 2 is a time chart showing a method of controlling thesemiconductor device 1. FIG. 2 shows the process of turning on andsubsequently turning off the semiconductor device 1. FIGS. 3A to 3C areschematic views showing the operation of the semiconductor device 1. Thecarrier density distribution inside the n-type base layer 11 is shown inFIGS. 3A to 3C. Here, the carrier density is the density including bothelectrons and holes.

FIG. 2 is a time chart showing the time-dependent change of a gatevoltage V_(MG) applied to the first gate electrode 40, a gate voltageV_(CG) applied to the second gate electrode 50, and a gate voltageV_(PG) applied to the third gate electrode 60. Here, the gate voltageV_(MG) is applied to the first gate electrode 40 via the first gate pad47 and the first gate interconnect 45. The gate voltage V_(CG) isapplied to the second gate electrode 50 via the second gate pad 57 andthe second gate interconnect 55. The gate voltage V_(PG) is applied tothe third gate electrode 60 via the third gate pad 67 and the third gateinterconnect 65.

At first, explained is the turning on process. For example, when turningon the semiconductor device 1, the gate voltages V_(MG), V_(CG), andV_(PG) that exceed the thresholds are applied to the first gateelectrode 40, the second gate electrode 50, and the third gate electrode60. Hereinbelow, applying a gate voltage that exceeds the threshold toeach gate electrode is called ON; and reducing the gate voltage of eachgate electrode to a voltage not more than the threshold is called OFF.

As shown in FIG. 2 , the first gate electrode 40, the second gateelectrode 50, and the third gate electrode 60 are turned on at a timet₁. Thereby, n-type channels are formed at the interface between thep-type base layer 13 and the gate insulating film 41, the interfacebetween the p-type base layer 13 and the gate insulating film 51, andthe interface between the p-type base layer 13 and the gate insulatingfilm 61; and the electric conduction is provided between the n-type baselayer 11 and the n-type emitter layer 15. In other words, thesemiconductor device 1 is set to the on-state.

Moreover, at portions of the first gate electrode 40, the second gateelectrode 50, and the third gate electrode 60, which are positionedinside the n-type base layer 11, n-type accumulation layers are formedat the interface between the n-type base layer 11 and the gateinsulating film 41, the interface between the n-type base layer 11 andthe gate insulating film 51, and the interface between the n-type baselayer 11 and the gate insulating film 61. The n-type accumulation layersinfluence and enhance the carrier accumulation in each region of then-type base layer 11 positioned between the gate electrodes is promoted;and the lower on-resistance can be obtained in the turned-on state.

FIG. 3A is a schematic view illustrating a carrier density distributionD₁ inside the n-type base layer 11 in such a state. By turning on thefirst gate electrode 40, the second gate electrode 50, and the thirdgate electrode 60, electrons are injected from the emitter electrode 20into the n-type base layer 11; and holes that correspond to the electroninjection are injected from the p-type collector layer 21 into then-type base layer 11 via the n-type buffer layer 19. As shown in FIG.3A, the carrier density inside the n-type base layer 11 is high on theemitter side. Thus, all of the first gate electrode 40, the second gateelectrode 50 and the third gate electrode 60 are turned on, and theturn-on time can be reduced.

Then, as shown in FIG. 2 , the third gate electrode 60 is turned off ata time t₂. Thereby, the n-type channel disappears, which is induced atthe interface between the p-type base layer adjacent to the third gateelectrode 60 and the gate insulating film 61. Therefore, the electricconduction is disconnected between the n-type emitter layer 15 and then-type base layer 11 on the third gate electrode 60 side; and the supplyof the electrons to the n-type base layer 11 stops. Accordingly, theamount of the holes injected from the p-type collector layer 21 into then-type base layer 11 via the n-type buffer layer 19 also decreases.

FIG. 3B is a schematic view showing the change of the carrier densitydistribution in this process. By turning off the third gate electrode60, the carrier density on the emitter side decreases in the n-type baselayer 11; and the density distribution changes from D₁ to D₂.

Then, explained is the turn off process. As shown in FIG. 2 , the secondgate electrode 50 is turned off at a time t₃.

The n-type channel disappears, which is induced at the interface betweenthe p-type base layer 13 adjacent to the second gate electrode 50 andthe gate insulating film 51; and the electric conduction also isdisconnected between the n-type emitter layer 15 and the n-type baselayer 11. Therefore, the supply of the electrons to the second gateelectrode 50 side stops. Accordingly, the amount of the holes injectedfrom the p-type collector layer 21 into the n-type base layer 11 via then-type buffer layer 19 also decreases.

FIG. 3C is a schematic view showing the change of the carrier densitydistribution in this process. By turning off the second gate electrode50, the carrier density on the emitter side decreases further in then-type base layer 11; and the density distribution changes from D₂ toD₃.

Then, by turning off the first gate electrode 40 at a time t₄, theinjection of electrons from the n-type emitter layer 15 into the n-typebase layer 11 stops completely; and the turn-off operation starts in thesemiconductor device 1. In the example, the second gate electrode 50 isturned off before the first gate electrode 40 is turned off; therefore,the density of carriers accumulated in the n-type base layer 11 havedecreased on the emitter side. In other words, the carrier density islower than the steady state in which the first gate electrode 40 and thesecond gate electrode 50 both are turned on. The carriers that areejected in the turn-off process after turning off the first gateelectrode 40 can be reduced thereby. In other words, compared to thecase where the second gate electrode 50 is not provided, the turn-offtime can be shortened; and the turn-off loss can be reduced.

When the potential of the second gate electrode 50 is further reduced toa negative potential, a p-type inversion layer is induced at theinterface between the n-type base layer 11 and the gate insulating film51. The ejection of the holes into the emitter electrode 20 via thep-type base layer 13 can be promoted thereby. As a result, the turn-offloss can be reduced further.

In the semiconductor device 1 according to the embodiment, the turn-ontime can be shortened by appropriately controlling the third gateelectrode 60. Also, in the turn-off process, the turn-off time can beshortened by appropriately controlling the second gate electrode 50. Asa result, in the semiconductor device 1, the switching loss can bereduced while maintaining the on-resistance.

FIG. 4 is a schematic cross-sectional view showing a semiconductordevice 2 according to a modification of the embodiment.

In the semiconductor device 2 shown in FIG. 4 , four of the third gateelectrodes 60 are disposed between the first gate electrode 40 and thesecond gate electrode 50. The number of the third gate electrodes 60 isan example and is not limited to the example. The semiconductor device 2also includes a first gate pad 75 and a second gate pad 77.

As shown in FIG. 4 , the first gate electrode 40 is connected to thefirst gate interconnect 45. The second gate electrode 50 is connected tothe second gate interconnect 55. The third gate electrode 60 isconnected to the third gate interconnect 65. The second gateinterconnect 55 is linked to the first gate pad 75; and the third gateinterconnect 65 is linked to the second gate pad 77.

The semiconductor device 2 further includes a resistance element R_(D)linking the first gate interconnect 45 and the second gate interconnect55. For example, the resistance element R_(D) is a semiconductor or ametal body that has the desired resistance value. For example, theresistance element R_(D) is placed in the terminal region of thesemiconductor part 10, and provided on the first surface 10T with aninsulating film interposed. The resistance element R_(D) may be placedat the periphery of the semiconductor part 10 and may be connected tothe first gate interconnect 45 and the second gate interconnect 55 by ametal interconnect, for example.

In the semiconductor device 2, the gate voltages V_(MG) and V_(CG) arerespectively applied to the first gate electrode 40 and the second gateelectrode 50 via the first gate pad 75. The gate voltage V_(PG) isapplied to the third gate electrode 60 via the second gate pad 77.

When the semiconductor device 2 is turned on, the gate voltages V_(MG),V_(CG), and V_(PG) that are higher than the thresholds are applied tothe first gate electrode 40, the second gate electrode 50, and the thirdgate electrode 60 via the first gate pad 75 and the second gate pad 77.At this time, a delay in the rise of the voltage applied to the firstgate electrode 40 occurs due to the RC time constant due to theresistance element R_(D) and a parasitic capacitance C. Therefore, thefirst gate electrode 40 is turned on after the second gate electrode 50is turned on. Then, the third gate electrode 60 is turned off at thetime t₂. The n-type channel disappears, which is induced at theinterface between the p-type base layer 13 adjacent to the third gateelectrode 60 and the gate insulating film 61. Therefore, the electricconduction is disconnected between the n-type emitter layer 15 and then-type base layer 11 on the third gate electrode 60 side; and the supplyof the electrons to the n-type base layer 11 stops. Accordingly, theamount of the holes injected from the p-type collector layer 21 into then-type base layer 11 via the n-type buffer layer 19 also decreases. Atthis time, for example, the turn-on operation can be faster by setting anumber of the third gate electrodes larger than the number of the firstgate electrodes.

The turn-off operation will be described as follows. The first gateelectrode 40 and the second gate electrode 50 are turned off via thefirst gate pad 75. At this time, a delay in the fall of the voltageapplied to the first gate electrode 40 occurs by the RC time constantdue to the resistance element R_(D) and the parasitic capacitance C.Therefore, the first gate electrode 40 is turned off after the secondgate electrode 50 is turned off. In other words, the second gateelectrode 50 is turned off before the first gate electrode 40 is turnedoff and the turn-off process is started; and the carrier density insidethe n-type base layer 11 is reduced. As a result, the turn-off time ofthe semiconductor device 2 can be shortened; and the switching loss canbe reduced.

In the example as well, the turn-on time can be shortened byappropriately controlling the third gate electrode 60; and the turn-offtime can be shortened by appropriately controlling the off-timing of thefirst gate electrode 40 with respect to the off-timing of the secondgate electrode 50. The delay of the time for turning off the first gateelectrode 40 can be controlled by placing the resistance element R_(D)that has the desired resistance value.

FIG. 5 is a schematic cross-sectional view showing a semiconductordevice 3 according to another modification of the embodiment.

The semiconductor device 3 shown in FIG. 5 also includes the first gatepad 75 and the second gate pad 77. The semiconductor part 10 of thesemiconductor device 3 further includes an n-type barrier layer 25 (asixth semiconductor layer) positioned between the n-type base layer 11and the p-type base layer 13.

The n-type barrier layer 25 includes the n-type impurities with a higherconcentration than the concentration of n-type impurities in the n-typebase layer 11. Also, the n-type barrier layer 25 includes the n-typeimpurities with a lower concentration than the concentration of n-typeimpurities in the n-type emitter layer 15. For example, the n-typebarrier layer 25 is provided to have an n-type impurity amount in therange of 1×10¹² to 1×10¹⁴ cm⁻² and has a thickness in the Z-direction inthe range of 0.1 to several μm. For example, the n-type barrier layer 25is formed by ion-implanting the n-type impurities on the first surface10T side of the semiconductor part 10.

In the semiconductor device 3, the turn-on time can be shortened byappropriately controlling the third gate electrode 60 at turn-on.Further, when the semiconductor device 3 is turned off, by delaying theoff-timing of the first gate electrode 40 with respect to the off-timingof the second gate electrode 50, the switching loss can be reduced whilemaintaining the on-resistance. In the example, by adding the n-typebarrier layer 25, the carrier accumulation on the emitter side can bepromoted further in the n-type base layer 11 during the turn-on (i.e.,during the steady state); and the lower on-resistance is achieved. Thus,it is possible to shorten the turn-on time and the turn-off time andreduce the on-resistance more effectively by providing the n-typebarrier layer 25.

FIG. 6 is a schematic cross-sectional view showing a semiconductordevice 4 according to yet another modification of the embodiment. Thesemiconductor device 4 has the structure similar to the semiconductordevice 1 shown in FIG. 1 . The semiconductor part 10 of thesemiconductor device 4 further includes an n-type barrier layer 25between the n-type base layer 11 and the p-type base layer 13. Then-type barrier layer 25 includes n-type impurities with a concentrationhigher than a concentration of n-type impurities in the n-type baselayer 11.

Also in the semiconductor device 4, a lower on-resistance can beachieved by adding the n-type barrier layer 25.

FIG. 7 is a schematic cross-sectional view showing a semiconductordevice 5 according to other modification of the embodiment. Thesemiconductor device 5 includes the first gate electrode 40, the secondgate electrode 50, and the third gate electrode 60. The first gateelectrode 40, the second gate electrode 50, and the third gate electrode60 are electrically connected to, for example, the first gate pad 47,the second gate pad 57, and the third gate pad 67, respectively, and canbe biased independently (see FIG. 1 ).

As shown in FIG. 7 , the first gate electrode is provided in aplurality, and the second gate electrode 50 is positioned between thefirst gate electrodes 40, for example. Moreover, the first gateelectrode is disposed so as to be positioned between the second gateelectrode 50 and the third gate electrode 60, for example.

The semiconductor part 10 includes the n-type base layer 11, the p-typebase layer 13, the n-type emitter layer 15, the p-type contact layer 17,the n-type buffer layer 19, the p-type collector layer 21 and an n-typebarrier 25. The embodiment may include a structure without the n-typebarrier layer 25.

The n-type emitter layer 15 is disposed to be in contact with the gateinsulating film 41. The first gate electrode 40 is disposed so as tooppose the n-type base layer 11, the n-type barrier layer 25, the p-typebase layer 13, and the n-type emitter layer 15 with the gate insulatingfilm 41 interposed. The second gate electrode 50 is disposed so as tooppose the n-type base layer 11, the n-type barrier layer 25, the p-typebase layer 13 and the p-type contact layer 17 with the insulating film51 interposed. The third gate electrode 60 is disposed so as to opposethe n-type base layer 11, the n-type barrier layer 25, the p-type baselayer 13, and the p-type contact layer 17 with the gate insulating film61 interposed.

FIGS. 8 and 9A to 9C are schematic views showing the operation of thesemiconductor device 5. FIG. 8 is a time chart showing temporal changesof the gate voltages V_(MG), V_(CG), V_(PG), the emitter-collectorvoltage V_(C)E, and the collector current I_(C). FIGS. 9A to 9C areschematic views showing carriers in the semiconductor part 10 in theperiods A, B and C shown in FIG. 8 . Then, the operation of thesemiconductor device 5 will be described with reference to FIGS. 8 and9A to 9C.

FIG. 8 shows gate voltages V_(MG), V_(CG), and V_(PG) applied to thefirst gate electrode 40, the second gate electrode 50, and the thirdgate electrode 60, respectively, during the turn-off process of thesemiconductor device 5 shifted from the on state to the off state. Thecollector current I_(C) and the emitter-collector electrode voltageV_(CE) are also shown, which are changed with the gate voltages V_(MG),V_(CG), and V_(PG). In the following description, it is assumed that thepotential of the emitter electrode 20 is at the ground potential (i.e.,zero level).

In the ON state, for example, the positive gate voltage V_(MG) equal toor higher than the threshold value is applied to the first gateelectrode 40, and the positive gate voltages V_(CG) and V_(PG) areapplied to the second gate electrode 50 and the third gate electrode 60,respectively.

As shown in FIG. 8 , in the turn-off process of the semiconductor device5, after the second gate electrode 50 and the third gate electrode 60are turned off at time t₃, the first gate electrode 40 is turned off attime t₄. For example, the gate voltage V_(CG) is decreased at time t₃from a positive voltage (for example, +15V) to a negative voltage (forexample, −15V). Further, the gate voltage V_(PG) is reduced at time t₃from a plus voltage (for example, +15V) to a zero level. Subsequently,the gate voltage V_(MG) is reduced at time t₄, from a positive voltage(for example, +15 V) to a zero level.

FIG. 9A shows the distribution of carriers (electrons) in thesemiconductor part 10 in the period A. In the period A, the first gateelectrode 40 is turned on, and makes it possible to inject the electronsinto the n-type barrier layer 15 and further into the n-type base layer11 from the n-type emitter layer 15 through the n-type channel inducedat the interface between the p-type base layer 13 and the gateinsulating film 41. Correspondingly, on the collector side (not shown),holes are injected from the p-type collector layer 21 into the n-typebase layer 11, and a collector current I_(C) (i.e., ON current) flows.

Further, by the gate voltages V_(CG) and V_(PG) (positive voltage)applied to the second gate electrode 50 and the third gate electrode 60,the n-type accumulation layers are induced at the interfaces between then-type base layer 11 and the gate insulating film 51, between the n-typebarrier layer 25 and the gate insulating film 51, between the n-typebase layer 11 and the gate insulating film 61, and between the n-typebarrier layer 25 and the gate insulating film 61. Thereby, the holesinjected from the p-type collector layer 21 into the n-type base layer11 further increases. As a result, the carrier amount in the n-type baselayer 11 and the n-type barrier layer 25 is increased, and makes theon-resistance lower. In the period A shown in FIG. 8 , theemitter-collector electrode voltage V_(CE) corresponding to thecollector current I_(C) is suppressed by the reduced on-resistance, andthus, the power consumption V_(CE)*I_(C) can be reduced.

In the period B shown in FIG. 8 , the second gate electrode 50 and thethird gate electrode 60 are turned off. As shown in FIG. 9B, the n-typeaccumulation layers disappear, which are induced at the interfacesbetween the n-type base layer 11 and the gate insulating film 51,between the n-type barrier layer 25 and the gate insulating film 51,between the n-type base layer 11 and the gate insulating film 61, andbetween the n-type barrier layer 25 and the gate insulating film 61.Thereby, the amount of holes injected from the p-type collector layer 21to the n-type base layer 11 is reduced. In contrast, as the first gateelectrode 40 remains in the on state, the collector current I_(C)continues to flow. That is, the electron injection from the n-typeemitter layer 15 into the n-type barrier layer 25 and the n-type baselayer 11 is maintained, and correspondingly, holes are injected from thep-type collector layer 21 into the n-type base layer 11. Further, thegate voltage V_(CG) applied to the second gate electrode 50 is anegative voltage, and induces a p-type accumulation layer at theinterfaces between the n-type base layer 11 and the gate insulating film51, between the n-type barrier layer 25 and the gate insulating film 51,and between the p-type base layer 13 and the gate insulating film 51.Thereby, the hole ejection path is formed from the n-type base layer 11and the n-type barrier layer 25 to the p-type contact layer 17. Thus,the holes are ejected from the n-type base layer 11 and the n-typebarrier layer 25 to the emitter electrode 20, and the carrier amount inthe n-type base layer 11 and the n-type barrier layer 25 is furtherreduced.

As a result, the collector current I_(C) flows under the increasedon-resistance by the reduced carrier amount in the n-type base layer 11and the n-type barrier layer 25. Thus, the emitter-collector voltageV_(CE) increases, and the power consumption V_(CE)*I_(C) increasesslightly.

In the period C shown in FIG. 8 , the first gate electrode 40 is furtherturned off. For example, when the gate voltage V_(MG) is decreased inorder to turn off the first gate electrode 40, the potential of thefirst gate electrode 20 is not immediately lowered to the off potential.For example, while discharging the parasitic capacitor of the first gateelectrode 40, the collector current I_(C) is maintained to besubstantially constant.

Subsequently, when the potential of the first gate electrode 40 startsto be reduced, the n-type channel gradually disappears at the interfacebetween the p-type base layer 13 and the gate insulating film 41. Then,the collector current I_(C) starts to decrease; and theemitter-collector voltage V_(CE) starts to rise. The emitter-collectorvoltage V_(CE), for example, once overshoots, and then, becomes theconstant off-voltage.

During this period, the carriers in the n-type base layer 11 and then-type barrier layer 25 are ejected to the emitter electrode 20 and thecollector electrode 30, and the n-type base layer 11 and the n-typebarrier layer 25 are depleted.

As shown in FIG. 9C, the holes in the n-type base layer 11 and then-type barrier layer 25 are ejected to the emitter electrode 20. At thistime, as the negative voltage is applied to the second gate electrode 50(for example, V_(CG)=−15V), the p-type accumulation layer is induced atthe interfaces between the n-type base layer 11 and the gate insulatingfilm 51, and between the n-type barrier layer 25 and the gate insulatingfilm 51. Thus, the holes in the n-type base layer 11 and the n-typebarrier layer 25 are quickly ejected to the emitter electrode 20 throughthe p-type accumulation layer and the p-type base layer 13.

Further, a negative voltage is applied to the first gate electrode 40(for example, V_(MG)=−15V) to induce a p-type accumulation layer at theinterfaces between the n-type base layer 11 and the gate insulating film41, and between the n-type barrier layer 25 and the gate insulating film41. Thereby, the hole ejection is enhanced from the n-type base layer 11and the n-type barrier layer 25 to the emitter electrode 20 through thep-type accumulation layer.

Further, in the period D shown in FIG. 8 , the collector current I_(C)decreases to the zero level, and the semiconductor device 5 is turnedoff at time t₅.

In the embodiment, the carrier ejection from the n-type base layer 11and the n-type barrier layer 25 can be enhanced by providing the secondgate electrode 50 and the third gate electrode 60, and the turn-offperiod C can be shortened.

Moreover, before applying the off voltage (for example, V_(MG)=−15V) tothe first gate electrode 40 at time t₄, the second gate electrode 50 andthe third gate electrode 60 are turned off at time t₃. Thereby, it ispossible in the period B to start the turn-off period C after thecarriers are reduced beforehand in the n-type base layer 11 and then-type barrier layer 25. As a result, the turn-off period C can befurther shortened.

For example, the variation of the emitter-collector voltage V_(CE)indicated by a broken line in FIG. 8 exhibits the characteristicswithout the second gate electrode 50 and the third gate electrode 60. Itis found that the turn-off period can be shortened by providing thesecond gate electrode 50 and the third gate electrode 60 as comparedwith the temporal change indicated by the solid line that shows thecharacteristics of the emitter-collector voltage V_(CE) according to theembodiment.

The power consumption V_(CE)*I_(C) in the turn-off period C depends onthe length thereof, and the switching loss can be reduced by shorteningthe turn-off period C. In the semiconductor device 5 according to theembodiment, the on-resistance and the switching loss can be reduced byappropriately controlling the second gate electrode 50 and the thirdgate electrode 60.

For example, in the semiconductor device 5, the power consumptionV_(CE)*I_(C) is slightly increased in the period B by reducing thecarrier amount in the n-type base layer 11 and the n-type barrier layer25. However, the power consumption V_(CE)*I_(C) is reduced moreeffectively by the shortening of the turn-off period C, and theswitching loss can be reduced as a whole.

Moreover, by applying a negative voltage to the third gate electrode 60(for example, V_(PG)=−15V), the hole ejection from the n-type base layer11 and the n-type barrier layer 25 can be further enhanced. However,such control causes a significant decrease of the carrier amount in then-type base layer 11 and the n-type barrier layer 25 in the period B,for example, and increases the power consumption V_(CE)*I_(C), resultingin the increase of the switching loss. Thus, by appropriately arrangingand controlling the second gate electrode 50 and the third gateelectrode 60 according to this embodiment, it is possible to reduce theon-resistance and the switching loss of the semiconductor device.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the invention.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor part including a first semiconductor layer of a firstconductivity type, the semiconductor part having a first surface and asecond surface, the second surface being positioned on a side oppositeto the first surface; a first electrode provided on the first surface; asecond electrode provided on the second surface; a first controlelectrode provided between the first electrode and the semiconductorpart, the first control electrode being electrically insulated from thesemiconductor part by a first insulating film, the first controlelectrode being electrically insulated from the first electrode by asecond insulating film; a second control electrode provided between thefirst electrode and the semiconductor part, the second control electrodebeing electrically insulated from the semiconductor part by a thirdinsulating film, the second control electrode being electricallyinsulated from the first electrode by a fourth insulating film; a thirdcontrol electrode provided between the first electrode and thesemiconductor part, the third control electrode being electricallyinsulated from the semiconductor part by a fifth insulating film, thethird control electrode being electrically insulated from the firstelectrode by a sixth insulating film, the first to third controlelectrodes being arranged along the first surface of the semiconductorpart; a first interconnect electrically connected to the first controlelectrode; a second interconnect electrically connected to the secondcontrol electrode; a third interconnect electrically connected to thethird control electrode; a resistance element being connected to thefirst interconnect and the second interconnect, the first interconnectbeing electrically connected via the resistance element to the secondinterconnect; a first contact pad electrically connected to the secondcontrol electrode through the second interconnect, the first contact padbeing electrically connected to the first control electrode through thefirst interconnect, the resistance element and the second interconnect;and a second contact pad connected the third control electrode throughthe third interconnect, the semiconductor part including a secondsemiconductor layer of a second conductivity type, the secondsemiconductor layer being partially provided between the firstsemiconductor layer and the first electrode, a third semiconductor layerof the first conductivity type, the third semiconductor layer beingpartially provided between the second semiconductor layer and the firstelectrode, and a fourth semiconductor layer of the second conductivitytype, the fourth semiconductor layer being provided between the firstsemiconductor layer and the second electrode, the second semiconductorlayer facing the first control electrode with the first insulating filminterposed, the second semiconductor layer facing the second controlelectrode with the third insulating film interposed, the secondsemiconductor layer facing the third control electrode with the fifthinsulating film interposed.
 2. The device according to claim 1, whereinthe semiconductor part includes first to third trenches provided at thefirst surface side, and the first to third control electrodes aredisposed inside the first to third trenches, respectively.
 3. The deviceaccording to claim 1, wherein, the semiconductor part further includes afifth semiconductor layer of the first conductivity type, the fifthsemiconductor layer being provided between the first semiconductor layerand the fourth semiconductor layer, the fifth semiconductor layerincluding first-conductivity-type impurities with a higher concentrationthan a concentration of first-conductivity-type impurities in the firstsemiconductor layer.
 4. The device according to claim 1, wherein thesemiconductor part further includes a sixth semiconductor layer of thefirst conductivity type, the sixth semiconductor layer being providedbetween the first semiconductor layer and the second semiconductorlayer, the sixth semiconductor layer including first-conductivity-typeimpurities with a higher concentration than a concentration offirst-conductivity-type impurities in the first semiconductor layer. 5.The device according to claim 1, wherein the semiconductor part furtherincludes a plurality of seventh semiconductor layers of the secondconductivity type, the seventh semiconductor layers being partiallyprovided between the second semiconductor layer and the first electrode,the third and seventh semiconductor layers being arranged along thesecond semiconductor layer, the third semiconductor layer being providedto contact the first insulating film, one of the seventh semiconductorlayers being provided to contact the third insulating film, the other ofthe seventh semiconductor layers being provided to contact the fifthinsulating film; the first control electrode facing the first to thirdsemiconductor layers with the first insulating film interposed; thesecond control electrode facing the first and second semiconductorlayers and the one of the seventh semiconductor layers with the thirdinsulating film interposed; and the third control electrode facing thefirst and second semiconductor layers and the other of the seventhsemiconductor layers with the third insulating film interposed.
 6. Amethod of controlling the semiconductor device according to claim 1, themethod comprising: applying a first control voltage to the first contactpad, the first control voltage being higher than a threshold voltage ofthe first control electrode and a threshold voltage of the secondcontrol electrode; applying a second control voltage to the secondcontact pad, the second control voltage being higher than a thresholdvoltage of the third control electrode; applying a third control voltageto the second contact pad after the second control voltage, the thirdcontrol voltage being lower than the threshold voltage of the thirdcontrol electrode; and applying a fourth control voltage to the firstcontact pad after the third control voltage applied to the secondcontact pad, the fourth control voltage being lower than the thresholdvoltage of the first control electrode and the threshold voltage of thesecond control electrode.